5G commercial upgrade, CCL functional fillers usher in new opportunities
As the main material for processing and manufacturing printed circuit boards (PCBs), CCL can be used in the production of high-speed transmission equipment such as servers and memories, as well as components such as antennas, power amplifiers, and radars. It is widely used in televisions, radios, computers, computers, Mobile communications and other electronic products.
In 5G base stations, the circuit boards processed and manufactured by CCL are mainly used to produce communication equipment such as communication base station antennas and power amplifiers, which are installed in the communication network. Due to the substantial increase in communication frequency and transmission rate brought about by the upgrade of 5G communication technology, traditional CCL cannot meet the production requirements, and high-frequency and high-speed CCL has become the current main development trend of CCL.
According to the data, functional fillers are the main bearers of mechanical strength in substrate composites, so they are usually regarded as one of the most important research directions in the upgrading of copper clad laminate technology. The rapidly expanding and upgrading market also puts forward higher requirements for the supply of upstream materials in related industries. The domestic high-frequency and high-speed circuit board packing and mobile phone HDI board packing industries are expected to benefit from this industrial upgrading wave and achieve rapid development.
In order to meet the needs of high-frequency and high-speed data transmission, high-performance circuit substrates have become a necessary choice for making high-frequency and high-speed copper clad laminates. At present, with excellent dielectric constant and low dielectric loss performance, silica material is filled in polytetrafluoroethylene (PTFE) substrate as a reinforcing material, which has become the most important technical route for high-frequency and high-speed copper clad laminates. After adding silica functional filler, the dielectric properties and signal transmission quality of high-frequency and high-speed copper clad laminates can be improved to meet the quality requirements of 5G communication. At the same time, the silica functional filler also effectively improves the heat resistance and reliability of the circuit board.
In the current global high-end silica functional filler market, Japanese and American manufacturers still occupy a major position. However, with the further upgrading of my country’s 5G market, the copper clad laminate industry will gradually concentrate in China, and my country has also achieved large-scale production of spherical silicon micropowder, gradually forming a domestic alternative.